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GOLD BOND STRIKE GOLD PROCESS
Product Details:
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Product Description
* THE PROCESS IS USED AS A GOLD STRIKE BEFORE MAIN GOLD PLATING.
* PROMOTES ADHESION ON NICKEL AND NICKEL ALLOYS AND ON OTHER BASEMETALS.
* DEPOSITS IS GOLDEN YELLOW COLOR.DEPOSIT IS 99.98% PURE. USED FOR ELECTRONIC AND DECORATIVE APPLICATIONS.
Other Products in 'Gold Plating Chemicals' category
Contact Details
GST : 24AABCM0632N1ZM
Phone :View Number
Key Personnel
Mr. VINOD L SHAH
(Managing Director)
Mobile :View Number
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MAHAVIR EXPOCHEM LTD.
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